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HomeBreaking NewsPara Light Launches ThermaFlatTM SiC MOSFETs to Break the Thermal Barrier in...

Para Light Launches ThermaFlatTM SiC MOSFETs to Break the Thermal Barrier in High-Power Applications

Breakthrough ultra-low RDS(on) drift technology delivers higher efficiency, greater power density, and enhanced reliability for next-generation power systems. NEW DELHI, Aug. 5, 2026 /PRNewswire/ — Para Light Electronics today announced the official launch of its ThermaFlatTM SiC MOSFET. ..

Read full story on Pr Newswire Apac

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