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HomeBusinessIntel taps industry veteran Seok-Hee Lee to lead foundry packaging push

Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

June 18: Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens focus on its advanced packaging business. The American chipmaker has been trying to reinvigorate its manufacturing business under CEO Lip-Bu Tan, after missing out on the AI boom.

Read full story on Channel Newsasia

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